Advanced AGR21090EF

Package / Case

Axial

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

Axial

Number of Terminals

2

Transistor Element Material

SILICON

RoHS

Details

Brand

Advanced Semiconductor, Inc.

Manufacturer

Advanced Semiconductor, Inc.

Factory Pack QuantityFactory Pack Quantity

10

Package Description

FLANGE MOUNT, R-CDFM-F2

Package Style

FLANGE MOUNT

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Reflow Temperature-Max (s)

30

Operating Temperature-Max

200 °C

Manufacturer Part Number

AGR21090EF

Package Shape

RECTANGULAR

Number of Elements

1

Part Life Cycle Code

Active

Ihs Manufacturer

AVAGO TECHNOLOGIES INC

Risk Rank

5.25

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-65°C ~ 175°C

Series

Military, MIL-PRF-55182/01, RNC55

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Size / Dimension

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

Tolerance

±0.5%

JESD-609 Code

e0

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Number of Terminations

2

ECCN Code

EAR99

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

±25ppm/°C

Resistance

124 kOhms

Terminal Finish

TIN LEAD

Composition

Metal Film

Power (Watts)

0.125W, 1/8W

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HIGH RELIABILITY

Subcategory

MOSFETs

Technology

Si

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Peak Reflow Temperature (Cel)

225

Reach Compliance Code

compliant

JESD-30 Code

R-CDFM-F2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

S (0.001%)

Configuration

SINGLE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

SOURCE

Transistor Application

AMPLIFIER

Polarity/Channel Type

N-CHANNEL

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

RF MOSFET Transistors

DS Breakdown Voltage-Min

65 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

250 W

Highest Frequency Band

S BAND

Features

Military, Moisture Resistant, Weldable

Product Category

a particular group of related products.

RF MOSFET Transistors

Height Seated (Max)

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