Advanced AGR26125EF

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

2

Transistor Element Material

SILICON

Factory Pack QuantityFactory Pack Quantity

10

Manufacturer

Advanced Semiconductor, Inc.

Brand

Advanced Semiconductor, Inc.

RoHS

Details

Risk Rank

5.25

Ihs Manufacturer

BROADCOM LTD

Part Life Cycle Code

Active

Number of Elements

1

Package Shape

RECTANGULAR

Manufacturer Part Number

AGR26125EF

Reflow Temperature-Max (s)

30

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Style

FLANGE MOUNT

Package Description

FLANGE MOUNT, R-CDFM-F2

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

JESD-609 Code

e0

ECCN Code

EAR99

Terminal Finish

TIN LEAD

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HIGH RELIABILITY

Subcategory

MOSFETs

Technology

Si

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Peak Reflow Temperature (Cel)

225

Reach Compliance Code

compliant

JESD-30 Code

R-CDFM-F2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

SOURCE

Polarity/Channel Type

N-CHANNEL

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

RF MOSFET Transistors

DS Breakdown Voltage-Min

65 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band

ULTRA HIGH FREQUENCY BAND

Product Category

a particular group of related products.

RF MOSFET Transistors