Advanced AGR09090EF

Mounting Type

Surface Mount, MLCC

Package / Case

1111 (2828 Metric)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

2

Transistor Element Material

SILICON

Package

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Mfr

American Technical Ceramics

Product Status

Active

Voltage Rated

RATED voltage is the voltage on the nameplate - the "design point" for maximum power throughput and safe thermal operation.

300V

Factory Pack QuantityFactory Pack Quantity

10

Manufacturer

Advanced Semiconductor, Inc.

Brand

Advanced Semiconductor, Inc.

RoHS

Details

Package Description

FLANGE MOUNT, R-CDFM-F2

Package Style

FLANGE MOUNT

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Reflow Temperature-Max (s)

30

Operating Temperature-Max

200 °C

Manufacturer Part Number

AGR09090EF

Package Shape

RECTANGULAR

Number of Elements

1

Part Life Cycle Code

Active

Ihs Manufacturer

BROADCOM LTD

Risk Rank

5.31

Drain Current-Max (ID)

8.5 A

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C ~ 125°C

Series

Porcelain Superchip® ATC 100B

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Size / Dimension

0.110 L x 0.110 W (2.79mm x 2.79mm)

Tolerance

±5%

JESD-609 Code

e0

ECCN Code

EAR99

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

P90

Terminal Finish

TIN LEAD

Applications

RF, Microwave, High Frequency, Bypass, Decoupling

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HIGH RELIABILITY

Capacitance

180 pF

Subcategory

MOSFETs

Technology

Si

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Peak Reflow Temperature (Cel)

225

Reach Compliance Code

compliant

JESD-30 Code

R-CDFM-F2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

-

Lead Spacing

the distance between two baselines of lines of type. The word 'leading' originates from the strips of lead hand-typesetters used to use to space out lines of text evenly. The word leading has stuck, but essentially it's a typographer's term for line spacing.

-

Configuration

SINGLE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Lead Style

-

Case Connection

SOURCE

Transistor Application

AMPLIFIER

Polarity/Channel Type

N-CHANNEL

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

RF MOSFET Transistors

Drain Current-Max (Abs) (ID)

8.5 A

DS Breakdown Voltage-Min

65 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

219 W

Highest Frequency Band

ULTRA HIGH FREQUENCY BAND

Features

High Q, Low Loss, Low ESL

Product Category

a particular group of related products.

RF MOSFET Transistors

Height Seated (Max)

-

Thickness (Max)

0.102 (2.59mm)

Ratings

-