Advanced AGR21060EF

Package / Case

0603 (1608 Metric)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

0603

Number of Terminals

2

Transistor Element Material

SILICON

Package

Tape & Reel (TR)

Base Product Number

RS73G1JRT

Mfr

KOA Speer Electronics, Inc.

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

10

Manufacturer

Advanced Semiconductor, Inc.

Brand

Advanced Semiconductor, Inc.

RoHS

Details

Risk Rank

5.25

Ihs Manufacturer

BROADCOM LTD

Part Life Cycle Code

Active

Number of Elements

1

Package Shape

RECTANGULAR

Manufacturer Part Number

AGR21060EF

Operating Temperature-Max

200 °C

Reflow Temperature-Max (s)

NOT SPECIFIED

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Style

FLANGE MOUNT

Package Description

FLANGE MOUNT, R-CDFM-F2

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C ~ 155°C

Series

RS73-RT

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Size / Dimension

0.063 L x 0.031 W (1.60mm x 0.80mm)

Tolerance

±0.25%

JESD-609 Code

e0

Number of Terminations

2

ECCN Code

EAR99

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

±50ppm/°C

Resistance

43.2 Ohms

Terminal Finish

TIN LEAD

Composition

Thick Film

Power (Watts)

0.2W, 1/5W

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HIGH RELIABILITY

Subcategory

MOSFETs

Technology

Si

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

JESD-30 Code

R-CDFM-F2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

-

Configuration

SINGLE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Transistor Application

AMPLIFIER

Polarity/Channel Type

N-CHANNEL

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

RF MOSFET Transistors

DS Breakdown Voltage-Min

65 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

175 W

Highest Frequency Band

S BAND

Features

Automotive AEC-Q200

Product Category

a particular group of related products.

RF MOSFET Transistors

Height Seated (Max)

0.022 (0.55mm)

Ratings

AEC-Q200