Toshiba Semiconductor and Storage RFM04U6P(TE12L,F)

Factory Lead Time

18 Weeks

Package / Case

TO-243AA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Operating Temperature (Max.)

150°C

Usage Level

Automotive grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Published

2003

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

ECCN Code

EAR99

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

7W

Reach Compliance Code

unknown

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

2A

Frequency

470MHz

Configuration

Single

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Current - Test

500mA

Drain to Source Voltage (Vdss)

16V

Transistor Type

N-Channel

Continuous Drain Current (ID)

2A

Gate to Source Voltage (Vgs)

3V

Gain

13.3dB

Drain Current-Max (Abs) (ID)

2A

Power - Output

4.3W

FET Technology

METAL-OXIDE SEMICONDUCTOR

Voltage - Test

6V

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant