Toshiba 2SK2855(TE12L,F)

Material

Si

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Channel Mode

Enhancement

Number of Elements per Chip

1

Maximum Drain Source Voltage (V)

10

Maximum Gate Source Voltage (V)

±6

Maximum Continuous Drain Current (A)

1

Maximum Power Dissipation (mW)

500

Typical Drain Efficiency (%)

55(Min)

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Mounting

Surface Mount

Package Height

1.6(Max)

Package Width

2.5

Package Length

4.6(Max)

PCB changed

3

Tab

Tab

Supplier Package

PW-Mini

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

4

Configuration

Single Dual Source

Channel Type

N