Toshiba Semiconductor and Storage 2SK3075(TE12L,Q)

Mount

Surface Mount

Package / Case

TO-271AA

Number of Pins

3

Number of Elements

1

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Published

2009

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150°C

Min Operating Temperature

-45°C

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

20W

Reach Compliance Code

unknown

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

5A

Frequency

520MHz

Current - Test

50mA

Drain to Source Voltage (Vdss)

30V

Transistor Type

N-Channel

Continuous Drain Current (ID)

5A

Gate to Source Voltage (Vgs)

25V

Gain

11.7dB

Max Output Power

The maximum output power = the maximum output current × the rated output voltage

7.5W

Voltage - Test

9.6V

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant