Toshiba Semiconductor and Storage RFM01U7P(TE12L,F)

Package / Case

TO-243AA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Operating Temperature (Max.)

150°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Published

2009

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

3W

Reach Compliance Code

unknown

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

1A

Frequency

520MHz

Configuration

Single

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Current - Test

100mA

Drain to Source Voltage (Vdss)

20V

Transistor Type

N-Channel

Continuous Drain Current (ID)

1A

Gate to Source Voltage (Vgs)

10V

Gain

10.8dB

Drain Current-Max (Abs) (ID)

1A

Power - Output

1.2W

FET Technology

METAL-OXIDE SEMICONDUCTOR

Voltage - Test

7.2V

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant