Texas Instruments CSD88537NDT

Lifecycle Status

ACTIVE (Last Updated: 4 days ago)

Factory Lead Time

6 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

8-SOIC (0.154, 3.90mm Width)

Number of Pins

8

Weight

540.001716mg

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

15A

Number of Elements

2

Turn Off Delay Time

It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

5 ns

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C~150°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

NexFET™

JESD-609 Code

e4

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

8

ECCN Code

EAR99

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

AVALANCHE RATED

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

2.1W

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Base Part Number

CSD88537

Number of Channels

2

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Dual

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

2.1W

Turn On Delay Time

Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

6 ns

FET Type

2 N-Channel (Dual)

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

15m Ω @ 8A, 10V

Vgs(th) (Max) @ Id

3.6V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

1400pF @ 30V

Gate Charge (Qg) (Max) @ Vgs

18nC @ 10V

Rise Time

In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

15ns

Fall Time (Typ)

19 ns

Continuous Drain Current (ID)

8A

Threshold Voltage

3V

Gate to Source Voltage (Vgs)

20V

Drain Current-Max (Abs) (ID)

8A

Drain-source On Resistance-Max

0.019Ohm

Drain to Source Breakdown Voltage

60V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Max Junction Temperature (Tj)

150°C

FET Feature

Standard

Height

1.75mm

Length

4.9mm

Width

3.91mm

Thickness

1.58mm

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free