Texas Instruments CSD87381P

Lifecycle Status

ACTIVE (Last Updated: 3 days ago)

Factory Lead Time

6 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

5-LGA

Number of Pins

5

Turn Off Delay Time

It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

16.8 ns

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C~150°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

NexFET™

JESD-609 Code

e4

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

5

ECCN Code

EAR99

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

4W

Terminal Position

UNSPECIFIED

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

UNSPECIFIED

Peak Reflow Temperature (Cel)

260

Number of Functions

1

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Base Part Number

CSD87381

Number of Outputs

1

Max Output Current

The maximum current that can be supplied to the load.

40A

Input Voltage-Nom

12V

Analog IC - Other Type

SWITCHING REGULATOR

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

4W

FET Type

2 N-Channel (Half Bridge)

Input Voltage (Max)

24V

Rds On (Max) @ Id, Vgs

16.3m Ω @ 8A, 8V

Vgs(th) (Max) @ Id

1.9V @ 250μA

Output Current per Channel

15A

Control Technique

PULSE WIDTH MODULATION

Input Capacitance (Ciss) (Max) @ Vds

564pF @ 15V

Gate Charge (Qg) (Max) @ Vgs

5nC @ 4.5V

Rise Time

In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

16.3ns

Drain to Source Voltage (Vdss)

30V

Fall Time (Typ)

2.9 ns

Switcher Configuration

BUCK

Continuous Drain Current (ID)

15A

Gate to Source Voltage (Vgs)

8V

Drain to Source Breakdown Voltage

30V

FET Feature

Logic Level Gate

Height

480μm

Length

3mm

Width

2.5mm

Thickness

400μm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free