Texas Instruments CSD87330Q3D

Lifecycle Status

ACTIVE (Last Updated: 1 day ago)

Factory Lead Time

12 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

8-PowerLDFN

Number of Pins

8

Turn Off Delay Time

It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

9.1 ns

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C~150°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Series

NexFET™

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

8

ECCN Code

EAR99

Terminal Finish

Matte Tin (Sn)

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

6W

Peak Reflow Temperature (Cel)

260

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.65mm

Base Part Number

CSD87330

Pin Count

a count of all of the component leads (or pins)

8

Number of Outputs

1

Efficiency

90 %

Output Type

Adjustable

Max Output Current

The maximum current that can be supplied to the load.

15A

Input Voltage-Nom

12V

Analog IC - Other Type

SWITCHING CONTROLLER

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Dual

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

6W

Max Output Voltage

The maximum output voltage refers to the dynamic area beyond which the output is saturated in the positive or negative direction, and is limited according to the load resistance value.

1.2V

FET Type

2 N-Channel (Half Bridge)

Max Input Voltage

27V

Vgs(th) (Max) @ Id

2.1V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

900pF @ 15V

Gate Charge (Qg) (Max) @ Vgs

5.8nC @ 4.5V

Rise Time

In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

7.5ns

Supply Current-Max (Isup)

20mA

Drain to Source Voltage (Vdss)

30V

Fall Time (Typ)

1.6 ns

Switcher Configuration

PUSH-PULL

Continuous Drain Current (ID)

20A

Threshold Voltage

1V

Gate to Source Voltage (Vgs)

1.15V

Drain to Source Breakdown Voltage

30V

FET Feature

Logic Level Gate

Height

1.5mm

Length

3.3mm

Width

3.3mm

Thickness

1.5mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Contains Lead