Texas Instruments CSD86330Q3D

Lifecycle Status

ACTIVE (Last Updated: 4 days ago)

Factory Lead Time

6 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

8-PowerLDFN

Number of Pins

8

Turn Off Delay Time

It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

15.8 ns

Usage Level

Military grade

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C~150°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

NexFET™

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

8

ECCN Code

EAR99

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

6W

Peak Reflow Temperature (Cel)

260

Number of Functions

1

Supply Voltage

12V

Terminal Pitch

The center distance from one pole to the next.

0.65mm

Base Part Number

CSD86330

Pin Count

a count of all of the component leads (or pins)

8

Supply Voltage-Max (Vsup)

22V

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Dual

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

6W

Turn On Delay Time

Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

5.3 ns

FET Type

2 N-Channel (Half Bridge)

Rds On (Max) @ Id, Vgs

9.6m Ω @ 14A, 8V

Vgs(th) (Max) @ Id

2.1V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

920pF @ 12.5V

Gate Charge (Qg) (Max) @ Vgs

6.2nC @ 4.5V

Drain to Source Voltage (Vdss)

25V

Continuous Drain Current (ID)

20A

Threshold Voltage

1.4V

Gate to Source Voltage (Vgs)

8V

Input Characteristics

STANDARD

Interface IC Type

BUFFER OR INVERTER BASED MOSFET DRIVER

Drain to Source Breakdown Voltage

25V

FET Feature

Logic Level Gate

High Side Driver

NO

Nominal Vgs

1.4 V

Height

1.5mm

Length

3.3mm

Width

3.3mm

Thickness

1.5mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Contains Lead