TDK-Epcos B66233G0250X187

Supplier Device Package

E 32 x 16 x 11

Material

N87

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

N87

Core Factor (ΣI/A) mm-1

0.76

Core Factor (ΣI/A) mm^-1

0.76

Package

Box

Mfr

EPCOS - TDK Electronics

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

420

Part # Aliases

B66233G250X187

Manufacturer

EPCOS / TDK

Brand

EPCOS / TDK

RoHS

Details

Outside Length

32 mm

Series

--

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Ammo Pack

Tolerance

--

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Gapped

Subcategory

Ferrites

Inductance

250 nH

Core Size

32 x 16 x 11

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ferrite Cores & Accessories

Finish

Uncoated

Core Type

E

Gap

--

Effective Length (le) mm

74

Product

Ferrite Cores

Product Category

a particular group of related products.

Ferrite Cores & Accessories

Width

11.00mm

Height

16.40mm

Length

32.00mm

Diameter

--