Qualcomm B39172B5323U410

Package / Case

QFN

Mounting Type

Surface Mount

Product Depth (mm)

3.2(mm)

Operating Temp Range

-20C to 70C

Mounting Styles

Surface Mount

Package

Tape & Reel (TR)

Mfr

Qualcomm (RF front-end (RFFE) filters)

Product Status

Obsolete

Frequency - Center

1.7475GHz

Manufacturer Part Number

B39172B5323U410

Manufacturer

TDK Corporation of America

Part Life Cycle Code

Transferred

Ihs Manufacturer

TDK CORP

Risk Rank

5.6

Usage Level

Commercial grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

B5323

Size / Dimension

0.118 L x 0.118 W (3.00mm x 3.00mm)

Applications

Base Stations

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

4

Bandwidth

75MHz

Filter Type

SAW FILTER

Screening Level

Commercial

Insertion Loss

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

2.7dB

Product Length (mm)

5(mm)

Height (Max)

0.043 (1.10mm)

Product Height (mm)

0.75(mm)

Ratings

-