Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39871B3715U410

Factory Lead Time

10 Weeks

Mounting Type

Surface Mount

Package / Case

6-SMD, No Lead

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2005

Size / Dimension

0.118Lx0.118W 3.00mmx3.00mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Applications

Remote Control

Insertion Loss

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

2.4dB

Frequency - Cutoff or Center

869MHz

Height (Max)

0.043 1.10mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant