Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39252B8312P810

Factory Lead Time

9 Weeks

Mounting Type

Surface Mount

Package / Case

5-SMD, No Lead

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2012

Size / Dimension

0.055Lx0.043W 1.40mmx1.10mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Height (Max)

0.016 0.40mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant