Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39431B3775Z810

Mounting Type

Surface Mount

Package / Case

8-SMD, No Lead

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Size / Dimension

0.150Lx0.150W 3.80mmx3.80mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Not For New Designs

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Applications

Remote Control

Insertion Loss

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

1.9dB

Frequency - Cutoff or Center

433.92MHz

Height (Max)

0.059 1.50mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Ratings

AEC-Q200