Micron Technology NAND01GW3B2AZA6E

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

Automotive

No

PPAP

No

Cell Type

NAND

Chip Density (bit)

1G

Block Organization

Symmetrical

Address Bus Width (bit)

28

Number of Bits/Word (bit)

8

Number of Words

128M

Programmability

Yes

Timing Type

Asynchronous

Max. Access Time (ns)

25000

Maximum Erase Time (S)

0.003/Block

Maximum Page Access Time (ns)

50(Min)

Maximum Programming Time (ms)

0.7/Page

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3.3|3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

30

Program Current (mA)

30

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

No

ECC Support

Yes

Support of Page Mode

Yes

Minimum Endurance (Cycles)

100000

Mounting

Surface Mount

Package Height

0.7(Max)

Package Width

9.5

Package Length

12

PCB changed

63

Standard Package Name

BGA

Supplier Package

VFBGA

Lead Shape

Ball

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

63

Architecture

Sectored

Sector Size

128Kbyte x 1024

Page Size

2Kbyte

Boot Block

No