Micron Technology NAND01GR3B2CZA6F

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

63

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

Automotive

No

PPAP

No

Cell Type

NAND

Chip Density (bit)

1G

Block Organization

Symmetrical

Address Bus Width (bit)

28

Number of Bits/Word (bit)

8

Number of Words

128M

Programmability

Yes

Timing Type

Asynchronous

Max. Access Time (ns)

25000

Maximum Erase Time (S)

0.003/Block

Maximum Page Access Time (ns)

45(Min)

Maximum Programming Time (ms)

0.7/Page

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.95

Operating Current (mA)

20

Program Current (mA)

20

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Command Compatible

Yes

ECC Support

Yes

Support of Page Mode

Yes

Mounting

Surface Mount

Package Height

0.7(Max)

Package Width

9

Package Length

11

PCB changed

63

Standard Package Name

BGA

Supplier Package

VFBGA

Lead Shape

Ball

Package Description

TFBGA,

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Number of Words Code

128000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

NOT SPECIFIED

Access Time-Max

25000 ns

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

NAND01GR3B2CZA6F

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

TFBGA

Package Shape

RECTANGULAR

Manufacturer

STMicroelectronics

Part Life Cycle Code

Transferred

Ihs Manufacturer

STMICROELECTRONICS

Risk Rank

5.37

Part Package Code

BGA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

ECCN Code

3A991.B.1.A

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.32.00.51

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

63

JESD-30 Code

R-PBGA-B63

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Supply Voltage-Max (Vsup)

1.95 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Voltage-Min (Vsup)

1.7 V

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ASYNCHRONOUS

Architecture

Sectored

Organization

128MX8

Seated Height-Max

1.05 mm

Memory Width

8

Memory Density

1073741824 bit

Parallel/Serial

PARALLEL

Memory IC Type

FLASH

Programming Voltage

A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

1.8 V

Sector Size

128Kbyte x 1024

Page Size

2Kbyte

Boot Block

No

Width

9 mm

Length

11 mm