M29F010B70K6T

Micron Technology M29F010B70K6T

Part No:

M29F010B70K6T

Manufacturer:

Micron Technology

Datasheet:

-

Package:

-

AINNX NO:

31954886-M29F010B70K6T

Description:

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    32
  • EU RoHS
    Not Compliant
  • ECCN (US)
    EAR99
  • Automotive
    No
  • PPAP
    No
  • Cell Type
    NOR
  • Chip Density (bit)
    1M
  • Block Organization
    Symmetrical
  • Address Bus Width (bit)
    17
  • Number of Bits/Word (bit)
    8
  • Number of Words
    128K
  • Programmability
    Yes
  • Timing Type
    Asynchronous
  • Max. Access Time (ns)
    70
  • Maximum Erase Time (S)
    6/Chip
  • Maximum Programming Time (ms)
    4500/Chip
  • OE Access Time (ns)
    30
  • Interface Type
    Parallel
  • Minimum Operating Supply Voltage (V)
    4.5
  • Typical Operating Supply Voltage (V)
    5
  • Maximum Operating Supply Voltage (V)
    5.5
  • Programming Voltage (V)
    4.5 to 5.5
  • Operating Current (mA)
    15
  • Program Current (mA)
    20
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Command Compatible
    Yes
  • ECC Support
    No
  • Support of Page Mode
    No
  • Mounting
    Surface Mount
  • Package Height
    3.18(Max)
  • Package Width
    11.56(Max)
  • Package Length
    14.1(Max)
  • PCB changed
    32
  • Standard Package Name
    LCC
  • Supplier Package
    PLCC
  • Lead Shape
    J-Lead
  • Package Description
    PLASTIC, LCC-32
  • Package Style
    CHIP CARRIER
  • Number of Words Code
    128000
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    LDCC32,.5X.6
  • Operating Temperature-Min
    -40 °C
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Access Time-Max
    70 ns
  • Operating Temperature-Max
    85 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    M29F010B70K6T
  • Supply Voltage-Nom (Vsup)
    5 V
  • Package Code
    QCCJ
  • Package Shape
    RECTANGULAR
  • Manufacturer
    STMicroelectronics
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    STMICROELECTRONICS
  • Risk Rank
    5.41
  • Part Package Code
    QFJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • JESD-609 Code
    e0
  • Pbfree Code
    No
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • ECCN Code
    EAR99
  • Type
    NOR TYPE
  • Terminal Finish
    TIN LEAD
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.51
  • Subcategory
    Flash Memories
  • Technology
    CMOS
  • Terminal Position
    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    J BEND
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27 mm
  • Reach Compliance Code
    unknown
  • Pin Count

    a count of all of the component leads (or pins)

    32
  • JESD-30 Code
    R-PQCC-J32
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ASYNCHRONOUS
  • Supply Current-Max
    0.02 mA
  • Architecture
    Sectored
  • Organization
    128KX8
  • Seated Height-Max
    3.56 mm
  • Memory Width
    8
  • Standby Current-Max
    0.0001 A
  • Memory Density
    1048576 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    FLASH
  • Programming Voltage

    A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

    5 V
  • Endurance
    100000 Write/Erase Cycles
  • Data Polling
    YES
  • Toggle Bit
    YES
  • Command User Interface
    YES
  • Number of Sectors/Size
    8
  • Sector Size
    16Kbyte x 8
  • Boot Block
    No
  • Width
    11.43 mm
  • Length
    13.97 mm
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