Micron Technology M29W400DB55ZE1E

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Cell Type

NOR

Chip Density (bit)

4M

Block Organization

Asymmetrical

Location of Boot Block

Bottom

Address Bus Width (bit)

19/18

Number of Bits/Word (bit)

8/16

Number of Words

512K/256K

Programmability

Yes

Timing Type

Asynchronous

Max. Access Time (ns)

55

Maximum Erase Time (S)

12/Chip

Maximum Programming Time (ms)

30000/Chip

OE Access Time (ns)

30

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6

Operating Current (mA)

10

Program Current (mA)

20

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Command Compatible

Yes

ECC Support

No

Support of Page Mode

No

Minimum Endurance (Cycles)

100000

Mounting

Surface Mount

Package Height

0.9

Package Width

6

Package Length

8

PCB changed

48

Standard Package Name

BGA

Supplier Package

TFBGA

Lead Shape

Ball

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

48

Architecture

Sectored

Sector Size

8Kbyte x 2|16Kbyte x 1|32Kbyte x 1|64Kbyte x 7

Boot Block

Yes