Micron Technology M58LW032D90ZA6

EU RoHS

Not Compliant

ECCN (US)

3A991.b.1.a

SVHC

Yes

SVHC Exceeds Threshold

Yes

Automotive

No

PPAP

No

Cell Type

NOR

Chip Density (bit)

32M

Block Organization

Symmetrical

Address Bus Width (bit)

22/21

Number of Bits/Word (bit)

8/16

Number of Words

4M/2M

Programmability

Yes

Timing Type

Asynchronous

Max. Access Time (ns)

90

Maximum Erase Time (S)

110/Chip

Maximum Page Access Time (ns)

25

Maximum Programming Time (ms)

0.048/Byte

OE Access Time (ns)

25

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6

Operating Current (mA)

20

Page Read Current (mA)

29@33MHz

Program Current (mA)

30

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

Yes

ECC Support

No

Support of Page Mode

Yes

Mounting

Surface Mount

Package Height

0.85(Max)

Package Width

10

Package Length

13

PCB changed

64

Standard Package Name

BGA

Supplier Package

TBGA

Lead Shape

Ball

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

64

Architecture

Sectored

Sector Size

128Kbyte x 32

Page Size

4Words/8byte

Boot Block

No