XKB CONNECTIVITY XKTF-1307-16

Weight

0

Overall Dimension

W13.4XD13.6XH1.6

Height from mounting surface (mm)

1.6

Soldering Temp (Max)

260°C

Name

#REF!

Contact Materials

Copper alloys

Conntact Coatings

Gold plated

Package Specifications

SMD

Maximum Self Height

1.6mm

Connecting Mode

Flip-lid type

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

8

Card Type

MicroSD卡(TF卡)