XKB CONNECTIVITY XKSIM-008

Weight

1.3

Overall Dimension

W24.6XD17.6XH1.8

Height from mounting surface (mm)

1.8

Soldering Temp (Max)

260°C

Name

#REF!

Contact Materials

Copper alloys

Conntact Coatings

Gold plated

Package Specifications

SMD

Maximum Self Height

1.8mm

Connecting Mode

Flip-lid type

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

6

Card Type

NanoSIM卡