XKB CONNECTIVITY XKNANO-1306

Weight

0.631

Overall Dimension

W14.0XD11.2XH1.4

Height from mounting surface (mm)

1.4

Soldering Temp (Max)

245°C

Name

#REF!

Contact Materials

Copper alloys

Conntact Coatings

Gold plated

Package Specifications

SMD

Maximum Self Height

1.4mm

Connecting Mode

Flip-lid type

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

6

Card Type

NanoSIM卡