WeEn Semiconductor Co Ltd BYV430K-300P

Contact plating

gold-plated

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of pins

34

Diode Element Material

SILICON

Number of Terminals

3

Exterior Housing Material

2

Part Life Cycle Code

Active

Ihs Manufacturer

WEEN SEMICONDUCTORS CO LTD

Package Description

TO-3P, SOT-1259, 3 PIN

Gross weight

3.23 g

Connector pinout layout

1x34

Electrical mounting

THT

Contacts pitch

2.54mm

Spatial orientation

straight

Kind of connector

female

Connector

socket

Type of connector

pin strips

Package Style

FLANGE MOUNT

Package Shape

RECTANGULAR

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Max

175 °C

Forward Voltage-Max (VF)

1.25 V

Operating temperature

-40...163°C

ECCN Code

EAR99

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

unknown

Current rating

1.5A

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Reference Standard

IEC-60134

JESD-30 Code

R-PSFM-T3

Configuration

COMMON CATHODE, 2 ELEMENTS

Diode Type

RECTIFIER DIODE

Case Connection

CATHODE

Number of Phases

1

Rep Pk Reverse Voltage-Max

300 V

Non-rep Pk Forward Current-Max

330 A

Reverse Current-Max

10 μA

Rated voltage

60V

Reverse Recovery Time-Max

0.055 μs

Reverse Test Voltage

300 V

2nd Connector Number of Positions Loaded

ULTRA FAST SOFT RECOVERY POWER

Profile

beryllium copper

Plating thickness

0.75µm

Flammability rating

UL94V-0