WeEn Semiconductor Co Ltd BYV430K-300P

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Diode Element Material

SILICON

Number of Terminals

3

Exterior Housing Material

2

Part Life Cycle Code

Active

Ihs Manufacturer

WEEN SEMICONDUCTORS CO LTD

Package Description

TO-3P, SOT-1259, 3 PIN

Forward Voltage-Max (VF)

1.25 V

Operating Temperature-Max

175 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x34

ECCN Code

EAR99

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

unknown

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Reference Standard

IEC-60134

JESD-30 Code

R-PSFM-T3

Configuration

COMMON CATHODE, 2 ELEMENTS

Diode Type

RECTIFIER DIODE

Case Connection

CATHODE

Number of Phases

1

Rep Pk Reverse Voltage-Max

300 V

Non-rep Pk Forward Current-Max

330 A

Reverse Current-Max

10 μA

Reverse Recovery Time-Max

0.055 μs

Reverse Test Voltage

300 V

2nd Connector Number of Positions Loaded

ULTRA FAST SOFT RECOVERY POWER

Profile

beryllium copper