WeEn Semiconductor Co Ltd BYC30X-600P

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Material

aluminium

Diode Element Material

SILICON

Number of Terminals

2

Exterior Housing Material

1

Type of heatsink

extruded

Heatsink shape

round

Material finishing

transparently anodized

Mounting

for back plate

Heatsinks features

LED adapter

Part Life Cycle Code

Active

Ihs Manufacturer

WEEN SEMICONDUCTORS CO LTD

Package Description

TO-220F, 3/2 PIN

Forward Voltage-Max (VF)

2.75 V

Operating Temperature-Max

175 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

ECCN Code

EAR99

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

LOW LEAKAGE CURRENT

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

unknown

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Reference Standard

IEC-60134

JESD-30 Code

R-PSFM-T2

Configuration

SINGLE

Diode Type

RECTIFIER DIODE

Case Connection

ISOLATED

Number of Phases

1

Rep Pk Reverse Voltage-Max

600 V

JEDEC-95 Code

TO-220AC

Non-rep Pk Forward Current-Max

220 A

Reverse Current-Max

10 μA

Reverse Recovery Time-Max

0.035 μs

2nd Connector Number of Positions Loaded

HYPER FAST RECOVERY POWER

Length

0.1m

Diameter

68.5mm