WeEn Semiconductor Co Ltd BYC15-600P

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Diode Element Material

SILICON

Number of Terminals

2

Exterior Housing Material

1

Part Life Cycle Code

Active

Ihs Manufacturer

WEEN SEMICONDUCTORS CO LTD

Forward Voltage-Max (VF)

3.2 V

Operating Temperature-Max

175 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Protection class

IP65

Number of switching cycles (electric)

50000

Relative humidity

45...85 %

Nominal voltage

250 V

ECCN Code

EAR99

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

LOW LEAKAGE CURRENT

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

unknown

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Reference Standard

IEC-60134

JESD-30 Code

R-PSFM-T2

Configuration

SINGLE

Diode Type

RECTIFIER DIODE

Case Connection

CATHODE

Number of Phases

1

Rep Pk Reverse Voltage-Max

600 V

JEDEC-95 Code

TO-220AC

Non-rep Pk Forward Current-Max

200 A

Reverse Current-Max

10 μA

Reverse Recovery Time-Max

0.018 μs

2nd Connector Number of Positions Loaded

HYPER FAST RECOVERY POWER

Contacts

4Pin

Diameter

35 mm