Vishay IRFB3307ZPBF

Material

Si

EU RoHS

Compliant with Exemption

ECCN (US)

EAR99

Automotive

No

PPAP

No

Category

Power MOSFET

Process Technology

HEXFET

Channel Mode

Enhancement

Number of Elements per Chip

1

Maximum Drain Source Voltage (V)

75

Maximum Gate Source Voltage (V)

±20

Maximum Gate Threshold Voltage (V)

4

Maximum Continuous Drain Current (A)

128

Typical Gate Charge @ Vgs (nC)

79@10V

Typical Gate Charge @ 10V (nC)

79

Typical Input Capacitance @ Vds (pF)

4750@50V

Maximum Power Dissipation (mW)

230000

Typical Fall Time (ns)

65

Typical Rise Time (ns)

64

Typical Turn-Off Delay Time (ns)

38

Typical Turn-On Delay Time (ns)

15

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

175

Mounting

Through Hole

Package Height

9.02(Max)

Package Width

4.82(Max)

Package Length

10.66(Max)

PCB changed

3

Tab

Tab

Standard Package Name

TO-220

Supplier Package

TO-220AB

Lead Shape

Through Hole

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

3

Configuration

Single

Channel Type

N