TMPM380FYFG

Toshiba Semiconductor and Storage TMPM380FYFG

Part No:

TMPM380FYFG

Datasheet:

TMPM380,382

Package:

100-LQFP

ROHS:

AINNX NO:

4875341-TMPM380FYFG

Description:

IC MCU 32BIT 256KB FLASH 100LQFP

Products specifications
  • Factory Lead Time
    18 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    100-LQFP
  • Number of Pins
    100
  • Data Converters
    A/D 18x12b
  • Number of I/Os
    83
  • Watchdog Timers
    Yes
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    TX03
  • Published
    2011
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    100
  • Terminal Position
    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Supply Voltage
    5V
  • Frequency
    40MHz
  • Base Part Number
    TMPM380
  • Pin Count

    a count of all of the component leads (or pins)

    100
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    5V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5V
  • Interface
    I2C, SSP, UART, USART
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    256kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    External
  • RAM Size
    16K x 8
  • Voltage - Supply (Vcc/Vdd)
    4.5V~5.5V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DMA, LVD, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    32-Bit
  • Program Memory Size
    256KB 256K x 8
  • Connectivity
    I2C, SIO, UART/USART
  • Supply Current-Max
    33mA
  • Bit Size
    32
  • Has ADC
    YES
  • DMA Channels
    YES
  • Data Bus Width
    32b
  • PWM Channels
    YES
  • Number of Timers/Counters
    11
  • Core Architecture
    ARM
  • CPU Family
    CORTEX-M3
  • Number of UART Channels
    5
  • Number of ADC Channels
    18
  • Number of I2C Channels
    2
  • Height
    1.4mm
  • Length
    14mm
  • Width
    14mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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