TMPM330FDFG(C)

Toshiba Semiconductor and Storage TMPM330FDFG(C)

Part No:

TMPM330FDFG(C)

Datasheet:

TMPM330 Family

Package:

100-LQFP

ROHS:

AINNX NO:

4878320-TMPM330FDFG(C)

Description:

IC MCU 32BIT 512KB FLASH 100LQFP

Products specifications
  • Factory Lead Time
    16 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    100-LQFP
  • Number of Pins
    100
  • Weight
    1.319103g
  • Data Converters
    A/D 12x10b
  • Number of I/Os
    79
  • Watchdog Timers
    Yes
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -20°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    TX03
  • Published
    2009
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Frequency
    40MHz
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    3.3V
  • Interface
    I2C, I2S, UART, USART
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    512kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    External
  • RAM Size
    32K x 8
  • Voltage - Supply (Vcc/Vdd)
    2.7V~3.6V
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    POR, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    32-Bit
  • Program Memory Size
    512KB 512K x 8
  • Connectivity
    I2C, SIO, UART/USART
  • Data Bus Width
    32b
  • Number of Timers/Counters
    10
  • Core Architecture
    ARM
  • Number of Programmable I/O
    78
  • Height
    1.4mm
  • Length
    14mm
  • Width
    14mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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