Toshiba Semiconductor and Storage TMP19A43FDXBG

Mounting Type

Surface Mount

Package / Case

193-FBGA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

193

Data Converters

A/D 16x10b; D/A 2x8b

Number of I/Os

143

ROM(word)

524288

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-20°C~85°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

TX19

Published

2007

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Not For New Designs

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

193

ECCN Code

3A991.A.2

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.31.00.01

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

600mW

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Terminal Pitch

The center distance from one pole to the next.

0.635mm

Frequency

40MHz

Base Part Number

TMP19A43

Pin Count

a count of all of the component leads (or pins)

193

Supply Voltage-Max (Vsup)

1.65V

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

1.52.53.3V

Supply Voltage-Min (Vsup)

1.35V

Interface

EBI/EMI, I2C, UART, USART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

512kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

External

RAM Size

24K x 8

Voltage - Supply (Vcc/Vdd)

1.35V~3.6V

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR, RISC

Core Processor

TX19A

Peripherals

DMA, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

32-Bit

Program Memory Size

512KB 512K x 8

Connectivity

EBI/EMI, I2C, UART/USART

Supply Current-Max

74mA

Bit Size

32

Access Time

40 μs

Data Bus Width

32b

Number of Timers/Counters

29

Address Bus Width

A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

24

Boundary Scan

YES

Low Power Mode

NO

Format

FIXED POINT

Integrated Cache

NO

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free