TMPM066FWUG

Toshiba Semiconductor and Storage TMPM066FWUG

Part No:

TMPM066FWUG

Datasheet:

TMPM066FW-68FW

Package:

64-LQFP

ROHS:

AINNX NO:

4848819-TMPM066FWUG

Description:

IC MCU 64LQFP

Products specifications
  • Factory Lead Time
    16 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    64-LQFP
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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