Toshiba Semiconductor and Storage RN2911,LF

Factory Lead Time

12 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

6-TSSOP, SC-88, SOT-363

Number of Pins

6

Collector-Emitter Breakdown Voltage

50V

hFEMin

120

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Published

2014

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150°C

Min Operating Temperature

-55°C

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

200mW

Polarity

PNP

Transistor Type

2 PNP - Pre-Biased (Dual)

Collector Emitter Voltage (VCEO)

300mV

Max Collector Current

100mA

DC Current Gain (hFE) (Min) @ Ic, Vce

120 @ 1mA 5V

Current - Collector Cutoff (Max)

100nA ICBO

Vce Saturation (Max) @ Ib, Ic

300mV @ 250μA, 5mA

Max Breakdown Voltage

50V

Frequency - Transition

200MHz

Collector Base Voltage (VCBO)

-50V

Emitter Base Voltage (VEBO)

-5V

Resistor - Base (R1)

10k Ω

Continuous Collector Current

-100mA

Height

900μm

Length

2mm

Width

1.25mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant