Toshiba Semiconductor and Storage RN2702TE85LF

Factory Lead Time

12 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

5-TSSOP, SC-70-5, SOT-353

Transistor Element Material

SILICON

Collector-Emitter Breakdown Voltage

50V

Number of Elements

2

hFEMin

50

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Published

2014

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

200mW

Polarity

PNP

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Dual

Power - Max

200mW

Transistor Type

2 PNP - Pre-Biased (Dual) (Emitter Coupled)

Collector Emitter Voltage (VCEO)

300mV

Max Collector Current

100mA

DC Current Gain (hFE) (Min) @ Ic, Vce

50 @ 10mA 5V

Current - Collector Cutoff (Max)

500nA

Vce Saturation (Max) @ Ib, Ic

300mV @ 250μA, 5mA

Max Breakdown Voltage

50V

Frequency - Transition

200MHz

Emitter Base Voltage (VEBO)

-10V

Resistor - Base (R1)

10k Ω

Continuous Collector Current

-100mA

Resistor - Emitter Base (R2)

10k Ω

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant