Toshiba Semiconductor and Storage RN2602(TE85L,F)

Factory Lead Time

12 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

SC-74, SOT-457

Collector-Emitter Breakdown Voltage

50V

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2001

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

300mW

Power - Max

300mW

Transistor Type

2 PNP - Pre-Biased (Dual)

Collector Emitter Voltage (VCEO)

300mV

Max Collector Current

100mA

DC Current Gain (hFE) (Min) @ Ic, Vce

50 @ 10mA 5V

Current - Collector Cutoff (Max)

100nA ICBO

Vce Saturation (Max) @ Ib, Ic

300mV @ 250μA, 5mA

Max Breakdown Voltage

50V

Frequency - Transition

200MHz

Resistor - Base (R1)

10k Ω

Resistor - Emitter Base (R2)

10k Ω

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant