TMX320F28377DZWTT

Texas Instruments TMX320F28377DZWTT

Part No:

TMX320F28377DZWTT

Manufacturer:

Texas Instruments

Package:

337-LFBGA

ROHS:

AINNX NO:

4935917-TMX320F28377DZWTT

Description:

IC MCU 32BIT 1MB FLASH 337NFBGA

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    337-LFBGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    337
  • Data Converters
    A/D 24x12b, 12x16b; D/A 3x12b
  • Number of I/Os
    169
  • Watchdog Timers
    Yes
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~105°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    C2000™ C28x Delfino™
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    337
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1.2V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8mm
  • Frequency
    200MHz
  • Base Part Number
    320F28377
  • Pin Count

    a count of all of the component leads (or pins)

    337
  • Interface
    CAN, EBI/EMI, I2C, SCI, SPI, UART, USART, USB
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    1MB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • RAM Size
    102K x 16
  • Voltage - Supply (Vcc/Vdd)
    1.14V~3.47V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    C28x
  • Peripherals
    POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    32-Bit Dual-Core
  • Program Memory Size
    1MB 512K x 16
  • Connectivity
    CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
  • Bit Size
    32
  • Has ADC
    YES
  • DMA Channels
    YES
  • Data Bus Width
    32b
  • PWM Channels
    YES
  • DAC Channels
    YES
  • Number of Timers/Counters
    6
  • Number of A/D Converters
    4
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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