Texas Instruments MSP430F169IPM

Factory Lead Time

6 Weeks

Lifecycle Status

ACTIVE (Last Updated: 4 days ago)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Package / Case

64-LQFP

Mounting Type

Surface Mount

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Number of Pins

64

Weight

342.689036mg

Watchdog Timers

Yes

Number of I/Os

48

Data Converters

A/D 8x12b; D/A 2x12b

Series

MSP430x1xx

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C TA

JESD-609 Code

e4

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

64

Termination

SMD/SMT

ECCN Code

EAR99

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Supply Voltage

2.2V

Terminal Pitch

The center distance from one pole to the next.

0.5mm

Frequency

8MHz

Pin Count

a count of all of the component leads (or pins)

64

Operating Supply Voltage

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

3.3V

Supply Voltage-Max (Vsup)

3.6V

Interface

I2C, IrDA, SCI, SPI, UART, USART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

60kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

1.8V~3.6V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Number of Bits

12

Core Processor

MSP430

Peripherals

Brown-out Detect/Reset, DMA, POR, PWM, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

16-Bit

Program Memory Size

60KB 60K x 8 + 256B

Connectivity

I2C, SPI, UART/USART

Supply Current-Max

0.6mA

Bit Size

16

Access Time

8 μs

Has ADC

YES

DMA Channels

YES

Data Bus Width

16b

PWM Channels

YES

DAC Channels

YES

Address Bus Width

A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

16b

Density

480 kb

Boundary Scan

YES

Low Power Mode

YES

Number of A/D Converters

8

Format

FIXED-POINT

Integrated Cache

NO

RAM (words)

2

Number of UART Channels

2

Number of Serial I/Os

2

Number of Timers

6

Number of I2C Channels

1

Width

10mm

Length

10mm

Height

1.6mm

Thickness

1.4mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

REACH SVHC

No SVHC

Lead Free

Lead Free