Texas Instruments MSP430F149IPAG

Lifecycle Status

ACTIVE (Last Updated: 1 week ago)

Factory Lead Time

6 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Mounting Type

Surface Mount

Package / Case

64-TQFP

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

64

Weight

274.706879mg

Data Converters

A/D 8x12b

Number of I/Os

48

ROM(word)

61440

Watchdog Timers

Yes

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

MSP430x1xx

JESD-609 Code

e4

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Number of Terminations

64

ECCN Code

EAR99

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Supply Voltage

3V

Terminal Pitch

The center distance from one pole to the next.

0.5mm

Frequency

8MHz

Pin Count

a count of all of the component leads (or pins)

64

Supply Voltage-Max (Vsup)

3.6V

Interface

SPI, UART, USART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

60kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

1.8V~3.6V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Number of Bits

12

Core Processor

MSP430

Peripherals

POR, PWM, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

16-Bit

Program Memory Size

60KB 60K x 8 + 256B

Connectivity

SPI, UART/USART

Bit Size

16

Access Time

8 μs

Has ADC

YES

DMA Channels

NO

Data Bus Width

16b

PWM Channels

YES

DAC Channels

NO

Number of Timers/Counters

2

Boundary Scan

YES

Low Power Mode

YES

Number of A/D Converters

8

Number of Programmable I/O

48

Format

FIXED-POINT

Integrated Cache

NO

RAM (words)

2

Number of Serial I/Os

2

Height

1.2mm

Length

10mm

Width

10mm

Thickness

1mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free