Texas Instruments TMS5704357BGWTEP

Factory Lead Time

6 Weeks

Mounting Type

Surface Mount

Package / Case

337-LFBGA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Data Converters

A/D 41x12b

Number of I/Os

145

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C~125°C TA

Series

Hercules™

JESD-609 Code

e0

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

337

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

220

Supply Voltage

1.2V

Terminal Pitch

The center distance from one pole to the next.

0.8mm

Reach Compliance Code

not_compliant

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Base Part Number

5704357

JESD-30 Code

S-PBGA-B337

Supply Voltage-Max (Vsup)

1.32V

Supply Voltage-Min (Vsup)

1.14V

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

Speed

300MHz

RAM Size

512K x 8

Voltage - Supply (Vcc/Vdd)

1.14V~1.32V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Core Processor

ARM® Cortex®-R5F

Peripherals

DMA, POR, PWM, WDT

Clock Frequency

80MHz

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

32-Bit

Program Memory Size

4MB 4M x 8

Connectivity

CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART

Bit Size

32

Has ADC

YES

DMA Channels

YES

PWM Channels

YES

DAC Channels

NO

EEPROM Size

128K x 8

On Chip Program ROM Width

8

Length

16mm

Height Seated (Max)

1.4mm

Width

16mm