MSP430F2012IN

Texas Instruments MSP430F2012IN

Part No:

MSP430F2012IN

Manufacturer:

Texas Instruments

Package:

14-DIP (0.300, 7.62mm)

ROHS:

AINNX NO:

4856324-MSP430F2012IN

Description:

MCU 16-bit MSP430 MSP430 RISC 2KB Flash 2.5V/3.3V 14-Pin PDIP

Products specifications
  • Factory Lead Time
    6 Weeks
  • Lifecycle Status
    ACTIVE (Last Updated: 1 day ago)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Package / Case
    14-DIP (0.300, 7.62mm)
  • Mounting Type
    Through Hole
  • Number of Pins
    14
  • Weight
    925.810377mg
  • Watchdog Timers
    Yes
  • RAM(byte)
    128
  • Number of I/Os
    10
  • Data Converters
    A/D 8x10b
  • Series
    MSP430F2xx
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • JESD-609 Code
    e4
  • Pbfree Code
    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    14
  • ECCN Code
    EAR99
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    2.2V
  • Frequency
    16MHz
  • Pin Count

    a count of all of the component leads (or pins)

    14
  • Supply Voltage-Max (Vsup)
    3.6V
  • Interface
    I2C, SPI
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    2kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • RAM Size
    128 x 8
  • Voltage - Supply (Vcc/Vdd)
    1.8V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    MSP430
  • Peripherals
    Brown-out Detect/Reset, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    16-Bit
  • Program Memory Size
    2KB 2K x 8 + 256B
  • Connectivity
    I2C, SPI
  • Bit Size
    16
  • Access Time
    16 μs
  • Has ADC
    YES
  • DMA Channels
    NO
  • Data Bus Width
    16b
  • DAC Channels
    NO
  • Number of Timers/Counters
    1
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • Number of A/D Converters
    8
  • Format
    FIXED-POINT
  • Integrated Cache
    NO
  • Number of UART Channels
    0
  • Number of PWM Channels
    2
  • Width
    6.35mm
  • Length
    19.3mm
  • Height
    5.08mm
  • Thickness
    3.9mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • REACH SVHC
    No SVHC
  • Lead Free
    Lead Free
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