TDK-Epcos B66315G0600X127

Supplier Device Package

E 25.4 x 10 x 7

Material

N27

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

N27

Core Factor (ΣI/A) mm-1

1.27

Core Factor (ΣI/A) mm^-1

1.27

Package

Box

Mfr

EPCOS - TDK Electronics

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

990

Part # Aliases

B66315G600X127

Manufacturer

EPCOS / TDK

Brand

EPCOS / TDK

Series

--

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

--

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Gapped

Subcategory

Ferrites

Inductance

600 nH

Core Size

25.4 x 10 x 7 (EF 20)

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ferrite Cores & Accessories

Finish

Uncoated

Core Type

E

Gap

--

Effective Length (le) mm

49.2

Product

Ferrite Cores

Product Category

a particular group of related products.

Ferrite Cores & Accessories

Width

6.50mm

Height

9.78mm

Length

25.40mm

Diameter

--