TDK-Epcos B65517W0000R030

Supplier Device Package

P 9 x 5

Material

N30

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

N30

Core Factor (ΣI/A) mm-1

1.13

Core Factor (ΣI/A) mm^-1

1.13

Package

Box

Mfr

EPCOS - TDK Electronics

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

1000

Part # Aliases

B65517WR30

Manufacturer

EPCOS / TDK

Brand

EPCOS / TDK

RoHS

Details

Series

B65517

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

-20%, +30%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Ungapped

Subcategory

Ferrites

Inductance

2.8 uH

Core Size

9 x 5

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ferrite Cores & Accessories

Finish

Uncoated

Core Type

P (Pot Core)

Gap

Ungapped

Effective Length (le) mm

13.4

Inductance Factor (Al)

2.5µH

Product

Ferrite Cores

Product Category

a particular group of related products.

Ferrite Cores & Accessories

Width

--

Height

2.70mm

Length

--

Diameter

9.30mm