TDK-Epcos B65807J0000R092

Supplier Device Package

RM 6

Material

N92

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

N92

Core Factor (ΣI/A) mm-1

0.78

Core Factor (ΣI/A) mm^-1

0.78

Package

Box

Mfr

EPCOS - TDK Electronics

Product Status

Active

Unit Weight

0.176370 oz

Factory Pack QuantityFactory Pack Quantity

500

Part # Aliases

B65807JR92

Manufacturer

EPCOS / TDK

Brand

EPCOS / TDK

RoHS

Details

Series

--

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Blister Pack

Tolerance

--

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Ungapped

Subcategory

Ferrites

Inductance

1.8 uH

Core Size

RM 6

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ferrite Cores & Accessories

Finish

Uncoated

Core Type

RM

Gap

--

Effective Length (le) mm

28.6

Product

Ferrite Cores

Product Category

a particular group of related products.

Ferrite Cores & Accessories

Width

8.20mm

Height

6.25mm

Length

17.90mm

Diameter

--