STMicroelectronics STM32F207VCT6

Lifecycle Status

ACTIVE (Last Updated: 7 months ago)

Factory Lead Time

12 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold, Tin

Mounting Type

Surface Mount

Package / Case

100-LQFP

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

100

Data Converters

A/D 16x12b; D/A 2x12b

Number of I/Os

82

Watchdog Timers

Yes

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

STM32F2

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

100

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

434mW

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Supply Voltage

3.3V

Terminal Pitch

The center distance from one pole to the next.

0.5mm

Frequency

120MHz

Base Part Number

STM32F207

Pin Count

a count of all of the component leads (or pins)

100

Interface

CAN, Ethernet, I2C, I2S, IrDA, LIN, MMC, SDIO, SPI, UART, USART, USB

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

256kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

132K x 8

Voltage - Supply (Vcc/Vdd)

1.8V~3.6V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Core Processor

ARM® Cortex®-M3

Peripherals

Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

32-Bit

Program Memory Size

256KB 256K x 8

Connectivity

CANbus, Ethernet, I2C, IrDA, LINbus, Memory Card, SPI, UART/USART, USB OTG

Bit Size

32

Has ADC

YES

DMA Channels

YES

Data Bus Width

32b

PWM Channels

YES

Number of Timers/Counters

14

Core Architecture

ARM

Number of ADC Channels

16

Number of I2C Channels

3

Number of USB Channels

2

Number of Ethernet Channels

1

Height

1.45mm

Length

14.2mm

Width

14.2mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free