STMicroelectronics STM32F103RBT6

Lifecycle Status

ACTIVE (Last Updated: 7 months ago)

Factory Lead Time

10 Weeks

Mounting Type

Surface Mount

Package / Case

64-LQFP

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Number of Pins

64

Number of I/Os

51

Data Converters

A/D 16x12b

Watchdog Timers

Yes

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

STM32F1

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

64

Terminal Finish

Matte Tin (Sn)

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

444mW

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Supply Voltage

3.3V

Terminal Pitch

The center distance from one pole to the next.

0.5mm

Frequency

72MHz

Base Part Number

STM32F103

Pin Count

a count of all of the component leads (or pins)

64

Supply Voltage-Max (Vsup)

3.6V

Supply Voltage-Min (Vsup)

2V

Interface

CAN, I2C, IrDA, LIN, SPI, UART, USART, USB

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

128kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

20K x 8

Voltage - Supply (Vcc/Vdd)

2V~3.6V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Number of Bits

32

Core Processor

ARM® Cortex®-M3

Peripherals

DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

32-Bit

Program Memory Size

128KB 128K x 8

Connectivity

CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB

Supply Current-Max

50mA

Bit Size

32

Has ADC

YES

DMA Channels

YES

Data Bus Width

32b

Number of Timers/Counters

4

Address Bus Width

A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

32b

Density

1 Mb

Core Architecture

ARM

CPU Family

CORTEX-M3

Number of ADC Channels

16

Number of PWM Channels

1

Number of I2C Channels

2

Height

1.45mm

Length

10mm

Width

10mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free