STMicroelectronics STM32F100C8T6B

Factory Lead Time

10 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Mounting Type

Surface Mount

Package / Case

48-LQFP

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

48

Data Converters

A/D 10x12b; D/A 2x12b

Number of I/Os

37

Watchdog Timers

Yes

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

STM32F1

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

48

ECCN Code

EAR99

Terminal Finish

Matte Tin (Sn) - annealed

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

363mW

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Supply Voltage

3V

Terminal Pitch

The center distance from one pole to the next.

0.5mm

Frequency

24MHz

Time@Peak Reflow Temperature-Max (s)

30

Base Part Number

STM32F100

Pin Count

a count of all of the component leads (or pins)

48

Interface

I2C, IrDA, LIN, SPI, UART, USART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

64kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

8K x 8

Voltage - Supply (Vcc/Vdd)

2V~3.6V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Core Processor

ARM® Cortex®-M3

Peripherals

DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

32-Bit

Program Memory Size

64KB 64K x 8

Connectivity

I2C, IrDA, LINbus, SPI, UART/USART

Supply Current-Max

15.7mA

Bit Size

32

Has ADC

YES

DMA Channels

YES

Data Bus Width

32b

Core Architecture

ARM

CPU Family

CORTEX-M3

Number of ADC Channels

10

Number of PWM Channels

6

Number of I2C Channels

2

Height

1.45mm

Length

7.2mm

Width

7.2mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free