Sharp Microelectronics S12MD3

Mount

Through Hole

Package / Case

DIP

Number of Elements

2

Operating Temperature (Min.)

-30°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Published

1997

JESD-609 Code

e0

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

Not Applicable

Terminal Finish

Tin/Lead (Sn/Pb)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

UL RECOGNIZED

Reach Compliance Code

unknown

Configuration

COMMON BIPOLAR TERMINAL, 2 ELEMENTS

Number of Channels

1

Optoelectronic Device Type

SCR OUTPUT OPTOCOUPLER

Output Current per Channel

200mA

Forward Current-Max

0.05A

Hold Current

the minimum current which must pass through a circuit in order for it to remain in the 'ON' state.

300μA

On-State Current-Max

0.2A

Input Trigger Current-Nom

15mA

Peak Off-state Voltage-Min

400V

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant