Samsung Semiconductor SGP13N60UFD

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

3

Transistor Element Material

SILICON

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Part Package Code

SFM

Package Description

FLANGE MOUNT, R-PSFM-T3

Number of Elements

1

Operating Temperature-Max

150 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Turn-off Time-Nom (toff)

160 ns

Turn-on Time-Nom (ton)

41 ns

ECCN Code

EAR99

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HIGH SPEED SWITCHING

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

R-PSFM-T3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Transistor Application

MOTOR CONTROL

Polarity/Channel Type

N-CHANNEL

JEDEC-95 Code

TO-220

Power Dissipation-Max (Abs)

60 W

Collector Current-Max (IC)

13 A

Collector-Emitter Voltage-Max

600 V

Gate-Emitter Voltage-Max

20 V

Gate-Emitter Thr Voltage-Max

7.5 V

Fall Time-Max (tf)

280 ns