M391B1G73QH0-YK0

Samsung Semiconductor M391B1G73QH0-YK0

Part No:

M391B1G73QH0-YK0

Datasheet:

-

Package:

-

AINNX NO:

32031232-M391B1G73QH0-YK0

Description:

Products specifications
  • EU RoHS
    Compliant
  • HTS
    8542.32.00.71
  • Automotive
    No
  • PPAP
    No
  • Module
    DRAM Module
  • Module Density
    8Gbyte
  • Number of Chip per Module
    18
  • Chip Density (bit)
    4G
  • Data Bus Width (bit)
    72
  • Max. Access Time (ns)
    0.225
  • Maximum Clock Rate (MHz)
    1600
  • Chip Configuration
    512Mx8
  • Chip Package Type
    78FBGA
  • Minimum Operating Supply Voltage (V)
    1.283
  • Typical Operating Supply Voltage (V)
    1.35
  • Maximum Operating Supply Voltage (V)
    1.45
  • Operating Current (mA)
    1125
  • Minimum Operating Temperature (°C)
    0
  • Maximum Operating Temperature (°C)
    95
  • Module Sides
    Double
  • ECC Support
    Yes
  • Number of Ranks
    Dual
  • Number of Chip Banks
    8
  • CAS Latency
    11
  • SPD EEPROM Support
    Yes
  • Mounting
    Socket
  • Package Height
    30
  • Package Width
    4(Max)
  • Package Length
    133.35
  • PCB changed
    240
  • Supplier Package
    UDIMM
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Pin Count

    a count of all of the component leads (or pins)

    240
  • Organization
    1Gx72
  • PLL
    No
  • Self Refresh
    Yes
  • Module Type
    240UDIMM
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